Tungsten Copper Heat Sink Facts

What is heat sink?

In electronic systems, a heat sink is a passive component that cools a device by dissipating heat into the surrounding air. Heat sinks are used to cool electronic components such as high-power semiconductor devices, and optoelectronic devices such as higher-power lasers and light emitting diodes (LEDs). Heat sinks are heat exchangers such as those used in refrigeration and air conditioning systems, or the radiator in an automobile.
A heat sink is designed to increase the surface area in contact with the cooling medium surrounding it, such as the air. Approach air velocity, choice of material, fin (or other protrusion) design and surface treatment are some of the factors which affect the thermal performance of a heat sink. Heat sinks are used to cool computer central processing units or graphics processors. Heat sink attachment methods and thermal interface materials also affect the eventual die temperature of the integrated circuit. Thermal adhesive or thermal grease fills the air gap between the heat sink and device to improve its thermal performance. Theoretical, experimental and numerical methods can be used to determine a heat sink's thermal performance.

What are tungsten copper heat sink facts?

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Tungsten copper heat sink facts is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be designed by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Metals (Kovar), etc. The products are widely application in the fields such as radio frequency, microwave, high power diode packaging and optical communication system.
Tungsten copper heat sink of advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available properties of WCu and MoCu heat materials.

Properties of Different Types of Tungsten Copper Heat Sink Facts:

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